Jeff Child

In this interview article, Renesas VP Peter Jenkins discusses how the company is leveraging its automotive sensor heritage and mixed-signal ICs to power the future of edge AI and humanoid robotics.

The flagship system-on-chip pairs a 4th-generation All Big Core CPU and dual neural processing units to drive high-end compute and proactive mobile intelligence.

Launched today, Delos Data’s Nonstop AI portfolio intros Apollo Data Interface silicon, the Morpheus development platform, and a system-level reference architecture to eliminate tail latency, maximize power efficiency, and scale agentic AI clusters.

The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and protect industrial edge networks.

Announced today, the new Ryzen AI Embedded X100 Series and Kria AI platform unify CPU, GPU, and NPU compute to provide the low-latency performance and deterministic control required for advanced physical AI robotics.

Cadence Claims ‘Industry First’ Agentic AI Platform for PCB and Advanced Packaging

Announced today, the new AMD Versal Premium Gen 2 MoP SoCs boost performance by integrating memory on-package. It cuts board space by 60% while gaining 288 GB/s bandwidth and 15-year lifecycle.

The new reference design leverages EPC’s monolithic GaN module to deliver an ultra-compact, high-efficiency motor drive solution specifically optimized for humanoid robotics and drones.

Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.

Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world network diagnostics for engineers.