Jeff Child

Launched today, Delos Data’s Nonstop AI portfolio intros Apollo Data Interface silicon, the Morpheus development platform, and a system-level reference architecture to eliminate tail latency, maximize power efficiency, and scale agentic AI clusters.

The new MCX A5 MCUs integrate 10BASE-T1S Ethernet, topology discovery, and post-quantum security to streamline and protect industrial edge networks.

Cadence Claims ‘Industry First’ Agentic AI Platform for PCB and Advanced Packaging

Announced today, the new AMD Versal Premium Gen 2 MoP SoCs boost performance by integrating memory on-package. It cuts board space by 60% while gaining 288 GB/s bandwidth and 15-year lifecycle.

The new reference design leverages EPC’s monolithic GaN module to deliver an ultra-compact, high-efficiency motor drive solution specifically optimized for humanoid robotics and drones.

Announced today, the all-in-one VL53L9CX combines stacked BSI SPAD technology, metasurface optics, and on-chip processing to deliver dense spatial awareness directly to small microcontrollers.

Thread Group and Broadband Forum are partnering to unify IoT mesh with broadband infrastructure. Also, the new Thread Tools app launches to provide real-world network diagnostics for engineers.

The new Elite Pairing Studio is an interactive cloud-based simulation tool designed to give power electronics engineers deep visibility into device-level switching behavior and component trade-offs.

Unveiled this week at PCIM, TI’s new automotive-grade battery monitor IC increases channel density by 44% and embeds real-time EIS to detect internal cell faults and mitigate thermal runaway.

The new framework enables hardware companies to go from zero infrastructure to a fully automated testing pipeline in days, leveraging an AI agent to generate register-level tests from PCB designs.