James Morra

Mini SOM Brings LLMs to Robots and Drones

Arm to Adopt Arteris Hardware Security in More CPUs

AOS Stacked Power MOSFETs Bring Half-Bridge Inside the Package

TI’s Battery-Management IC Uses EIS to Monitor Cells Inside and Out

Power MOSFETs Suppress Noise in Motor-Control Circuits

AMD Moves from HBM to LPDDR5X with New Memory-on-Package SoC

onsemi to Buy Synaptics in $7 Billion Deal

Analog Devices to Buy Power Chip Startup Empower in $1.5 Billion Deal

Empower’s Integrated Voltage Regulators Help Pull Heat Out of Processors

Infineon Reveals POL Converters to Feed Proliferating Power Rails in AI Chips

TI “Transforms” Isolated Power Modules with Multichip Packaging Tech

Stackable POL Converter Module Powers Processors from Below

Cadence’s HiFi DSP Purpose-Built for Next-Gen Voice AI and Audio

Multiprotocol Wireless SoCs Untangle the IoT (Part 1)

RF Module Brings It All Together for the Wireless IoT

What’s Inside a Wireless IoT SoC?

Siemens Unveils Software Tool to Simplify and Speed Up Testing for Analog ICs

Infineon and Delta Join Forces on Vertical Power Delivery for Data Centers

Cirrus Logic to Co-Invest with GlobalFoundries in BCD Process Technology

Cadence, NVIDIA Upgrade Pre-Silicon Power Modeling for Big AI Chips